product details dimension a dimension b dimension c dimension d interface material finish notes: dimensions are measure d in millimeters dimensions a & b refer to component size dimension c = the height of the heat sink shown ab ove and d oes not includ e the height of the attachment method ats reserves the right to up d ate or change it prod ucts without notice c ontact ats to learn a b out custom options available 1) 2) 3) 4) 5) t hermal performance for more information, to fnd a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (north america); +31 (0) 3569 84715 (europe). ats part # ATS-X53290P-C1-R0 features & benefts high performance bga cooling solutions with supergrip? attachment rev1_0908 air velocity thermal r esistance ft/min m/s c/w (unducted flow) c/w (ducted flow) 200 1.0 300 1.5 400 2.0 500 2.5 600 3.0 700 3.5 800 4.0 5.0 3.9 3.4 3.1 2.8 2.6 2.5 3.2 29 mm 29 mm 17.5 mm 29 mm blue anodized chomerics t -766 designed for 29 x 29 mm bga components supergrip tm super strong, uniform attachment force helps achieve maximum performance from phase-changing tim and does not require holes in the pcb allows the heat sink to be detached and reattached without damaging the component and/or the pcb, an important feature in the event a pcb may need to be reworked meets t elcordia gr-63-core o ffice v ibration, etsi 300 019 t ransportation v ibration, and mil-std-810 shock t esting and unpackaged drop t esting standards r equires minimal space around the components perimeter; ideal for densely populated pcbs keep-out requirements: an un-populated boarder zone of 3 mm around the component is necessary to facilitate the installation/removal of the supergrip?. please refer to the supergrip? keep-out guidelines and supergrip? installation/removal instructions for further details ? ? ? ? ? ? *image above is for illustration purposes only.
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